Prohibits US federal executive agencies from procuring or obtaining electronic parts, products, or services that include semiconductor products or services from named Chinese chipmakers, their subsidiaries and affiliates, or other entities determined to be owned or controlled by, or connected to, the government of a foreign country of concern. Agencies are also barred from contracting with entities that use such covered semiconductors in the products they supply to the government. The prohibitions take effect in December 2027.
